E-REON / RF & MICROWAVE SOLUTIONS
E-REON designs and builds equipment around defined RF performance and integration requirements, combining RF circuitry with electronics, embedded firmware, monitoring, mechanics and thermal management.
RF & MICROWAVE ENGINEERING
E-REON engineers and integrates RF signal paths, embedded control and specialised hardware for new equipment, system upgrades and long-term operational support.
Signal generation, processing and frequency translation for the required operating band.
Signal conditioning and routing developed around the required bandwidth, signal level and isolation.
RF gain, output power and antenna interfacing developed around the application requirements.
System-level engineering for new equipment and the continuing support of systems throughout their operational life.
DELIVERY SCOPE
E-REON delivers custom RF hardware and engineering outputs scaled to your exact needs, complete with the specific interfaces, verification and documentation your project demands.
BOARD-LEVEL RF HARDWARE
Custom board-level RF assemblies and power-amplifier pallets engineered around defined electrical, mechanical, thermal and interface requirements.
ENCLOSED RF MODULES
Core RF functions integrated into shielded enclosures with the required connectors, power, bias, control, protection and thermal-management paths.
RACK-MOUNT EQUIPMENT & INTEGRATED SYSTEMS
Application-specific and multi-channel equipment combining optimised RF paths, embedded control, monitoring telemetry, power distribution and external interfaces.
PROTOTYPES & TECHNICAL DATA PACKAGES
Functional prototypes and agreed technical documentation supporting evaluation, integration and subsequent development. Prototype maturity and TDP content are defined individually for each programme.
MARKETS & APPLICATIONS
E-REON supports equipment manufacturers, system integrators, laboratories and technical programme teams where RF performance, control, interfaces and verification must work together.
TEST, MEASUREMENT & ATE
Switching, attenuation, conditioning, amplification and monitoring integrated around DUT access, instrument interfaces, remote control and repeatable test execution.
APPLICATION EXAMPLES
AEROSPACE, DEFENCE & SECURITY
RF assemblies and subsystems developed around defined electrical performance, constrained interfaces, operating conditions and verification requirements.
APPLICATION EXAMPLES
COMMUNICATIONS & RADIO INFRASTRUCTURE
Amplification, conversion, conditioning and distribution developed for communications equipment, radio infrastructure, SDR-based systems and system evaluation.
APPLICATION EXAMPLES
INDUSTRIAL, SCIENTIFIC & RESEARCH
RF modules, control systems and integrated equipment for scientific, research and industrial applications where standard products do not meet the required performance, interfaces or physical format.
APPLICATION EXAMPLES
FROM RF REQUIREMENTS TO COMPLETE EQUIPMENT
E-REON ENGINEERING SCOPE
One coordinated equipment design, with every supporting function resolved around the RF requirement.Within the agreed delivery scope, E-REON resolves the RF path, embedded control, protection, power distribution, mechanical and thermal integration, and verification as one defined system configuration.
RF requirements translated into a defined signal path covering bandwidth, gain, noise, linearity, power, isolation and dynamic behaviour.
Bias, sequencing, monitoring, switching, embedded firmware and protection developed as part of the complete equipment.
Connectors, mounting, enclosure design, power distribution and heat transfer resolved around the installation constraints.
Measurements, configuration definition and agreed technical documentation aligned with the programme’s delivery requirements.
SELECTED WORK
These examples show three different solution boundaries: a configurable prototype platform, high-power RF application boards and repeatable test-laboratory assemblies.
A bidirectional dual-IF evaluation system developed as an adjustable and reconfigurable platform for customer prototype integration.
Two S-band GaN power-amplifier application-board variants covering 3.3–3.8 GHz for WiMAX and 5G applications.
A production batch of RF splitter and combiner assemblies prepared across four configurations for use in a 5G test laboratory.
